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24AA32A/24LC32A
32K I2CTM Serial EEPROM
Device Selection Table
Part Number 24AA32A 24LC32A Note 1: VCC Range 1.8-5.5 2.5-5.5 Max Clock Frequency 400 kHz(1) 400 kHz Temp Ranges I I, E
Description
The Microchip Technology Inc. 24AA32A/24LC32A (24XX32A*) is a 32 Kbit Electrically Erasable PROM. The device is organized as four blocks of 8K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.8V, with standby and active currents of only 1 A and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24XX32A also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32A is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP and MSOP packages.
100 kHz for VCC <2.5V
Features
* Single supply with operation down to 1.8V * Low-power CMOS technology - 1 mA active current typical - 1 A standby current (max.) (I-temp) * Organized as 4 blocks of 8K bits (32K bit) * 2-wire serial interface bus, I2CTM compatible * Cascadable for up to eight devices * Schmitt Trigger inputs for noise suppression * Output slope control to eliminate ground bounce * 100 kHz (<2.5V) and 400 kHz (2.5V) compatibility * Self-timed write cycle (including auto-erase) * Page write buffer for up to 32 bytes * 2 ms typical write cycle time for page write * Hardware write-protect for entire memory * Can be operated as a serial ROM * Factory programming (QTP) available * ESD protection > 4,000V * 1,000,000 erase/write cycles * Data retention > 200 years * 8-lead PDIP, SOIC, TSSOP and MSOP packages * Standard and Pb-free finishes available * Available temperature ranges: - Industrial (I): -40C to +85C - Automotive (E): -40C to +125C
Package Types
PDIP/SOIC/TSSOP/MSOP A0 1 A1 2 A2 3 Vss 4 ROTATED TSSOP (24AA32AX/24LC32AX) 1 2 3 4 8 7 6 5 24XX32X SCL SDA Vss A2
8 Vcc 7 WP WP Vcc 6 SCL A0 5 SDA A1
Block Diagram
A0 A1 A2 WP
24XX32
HV Generator
I/O Control Logic
Memory Control Logic
XDEC
EEPROM Array
Page Latches
I/O SDA Vcc VSS
SCL
YDEC
Sense Amp. R/W Control
*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.
2003 Microchip Technology Inc.
DS21713D-page 1
24AA32A/24LC32A
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied ................................................................................................-65C to +125C ESD protection on all pins ...................................................................................................................................................... 4 kV NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
VCC = +1.8V to +5.5V Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min
--
DC CHARACTERISTICS Param. Symbol No. D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 VIH -- VIL VHYS VOL ILI ILO CIN, COUT ICC read ICCS Standby current
Characteristic WP, SCL and SDA pins High-level input voltage Low-level input voltage Hysteresis of Schmitt Trigger inputs Low-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs)
Typ -- -- -- -- -- -- -- -- 0.1 0.05 0.01 --
Max -- -- 0.3 VCC -- 0.40 1 1 10 3 1 1 5
Units -- V V V V A A pF mA mA A A -- -- --
Conditions
0.7 VCC -- 0.05 VCC -- -- -- -- -- -- -- --
(Note 1) IOL = 3.0 mA, VCC = 2.5V VIN =.1V to VCC VOUT =.1V to VCC VCC = 5.0V (Note 1) TA = 25C, FCLK = 1 MHz VCC = 5.5V, SCL = 400 kHz -- Industrial Automotive SDA = SCL = VCC WP = VSS
ICC write Operating current
Note 1: 2:
This parameter is periodically sampled and not 100% tested. Typical measurements taken at room temperature.
DS21713D-page 2
2003 Microchip Technology Inc.
24AA32A/24LC32A
TABLE 1-2: AC CHARACTERISTICS
VCC = +1.8V to +5.5V Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Characteristic Clock frequency Clock high time Clock low time SDA and SCL rise time (Note 1) SDA and SCL fall time Start condition hold time Start condition setup time Data input hold time Data input setup time Stop condition setup time Output valid from clock (Note 2) Bus free time: Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum Input filter spike suppression (SDA and SCL pins) Write cycle time (byte or page) Endurance Min -- -- 600 4000 1300 4700 -- -- -- 600 4000 600 4700 0 100 250 600 4000 -- -- 1300 4700 20+0.1CB -- -- -- 1M Max 400 100 -- -- -- -- 300 1000 300 -- -- -- -- -- -- -- -- -- 900 3500 -- -- 250 250 50 5 -- Units kHz ns ns ns ns ns ns ns ns ns ns ns Conditions 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) (Note 1) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) (Note 2) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA32A) (Notes 1 and 3) -- AC CHARACTERISTICS Param. Symbol No. 1 2 3 4 5 6 7 8 9 10 11 12 FCLK
THIGH
TLOW TR TF THD:STA TSU:STA THD:DAT TSU:DAT TSU:STO TAA TBUF
13 14 15 16 Note 1: 2: 3: 4:
TOF TSP TWC --
ns ns ms
cycles 25C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model which can be obtained on Microchip's web site: www.microchip.com.
2003 Microchip Technology Inc.
DS21713D-page 3
24AA32A/24LC32A
FIGURE 1-1: BUS TIMING DATA
5 3 SCL 7 SDA IN 6 14 11 SDA OUT 12 8 9 10 4
2
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL 7 SDA 6 10
Start
Stop
DS21713D-page 4
2003 Microchip Technology Inc.
24AA32A/24LC32A
2.0 FUNCTIONAL DESCRIPTION
3.4 Data Valid (D)
The 24XX32A supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX32A works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically unlimited, (although only the last thirty two bytes will be stored when doing a write operation). When an overwrite does occur it will replace data in a first-in first-out (FIFO) fashion.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined: * Data transfer may be initiated only when the bus is not busy. * During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 3-1).
3.5
Acknowledge
Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: The 24XX32A does not generate any Acknowledge bits if an internal programming cycle is in progress.
3.1
Bus not Busy (A)
Both data and clock lines remain high.
3.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition.
The device that acknowledges, has to pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX32A) will leave the data line high to enable the master to generate the Stop condition.
FIGURE 3-1:
(A) SCL
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B) (D) (D) (C) (A)
SDA
START CONDITION
ADDRESS OR DATA ACKNOWLEDGE ALLOWED VALID TO CHANGE
STOP CONDITION
2003 Microchip Technology Inc.
DS21713D-page 5
24AA32A/24LC32A
3.6 Device Addressing
FIGURE 3-2: CONTROL BYTE FORMAT
Read/Write Bit Chip Select Bits 0 A2 A1 A0 R/W ACK A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX32A, this is set as `1010' binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX32A devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1, and A0 pins for the device to respond. These bits are in effect the three Most Significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to a `1', a read operation is selected. When set to a zero, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 3-3). Because only A11 to A0 are used, the upper four address bits are don't care bits. The upper address bits are transferred first, followed by the less significant bits. Following the Start condition, the 24XX32A monitors the SDA bus checking the device type identifier being transmitted and, upon receiving a `1010' code and appropriate device select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX32A will select a read or write operation.
Control Code S 1 0 1
Slave Address Start Bit Acknowledge Bit
3.7
Contiguous Addressing Across Multiple Devices
The Chip Select bits A2, A1, A0 can be used to expand the contiguous address space for up to 256K bits by adding up to eight 24XX32A's on the same bus. In this case, software can use A0 of the control byte as address bit A12, A1 as address bit A13, and A2 as address bit A14. It is not possible to sequentially read across device boundaries.
FIGURE 3-3:
ADDRESS SEQUENCE BIT ASSIGNMENTS
ADDRESS HIGH BYTE ADDRESS LOW BYTE
CONTROL BYTE
1
0
1
0
A 2
A 1
A R/W 0
X
X
X
AA X 11 10 A A 98
A 7
*
*
*
*
*
*
A 0
CONTROL CODE
CHIP SELECT BITS
X = Don't Care Bit
DS21713D-page 6
2003 Microchip Technology Inc.
24AA32A/24LC32A
4.0
4.1
WRITE OPERATIONS
Byte Write
4.2
Page Write
Following the Start condition from the master, the control code (4 bits), the Chip Select (3 bits), and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow once it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word address and will be written into the address pointer of the 24XX32A. The next byte is the Least Significant Address Byte. After receiving another Acknowledge signal from the 24XX32A, the master device will transmit the data word to be written into the addressed memory location. The 24XX32A acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX32A will not generate Acknowledge signals (Figure 4-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cycle will occur. No data will be written and the device will immediately accept a new command. After a byte Write command, the internal address counter will point to the address location following the one that was just written.
The write control byte, word address and the first data byte are transmitted to the 24XX32A in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 31 additional bytes which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the five lower-address pointer bits are internally incremented by `1'. If the master should transmit more than 32 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 4-2). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cycle will occur, no data will be written and the device will immediately accept a new command. Note: Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or `page size') and, end at addresses that are integer multiples of [page size - 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.
4.3
Write-Protection
The WP pin allows the user to write-protect the entire array (0000-0FFFF) when the pin is tied to VCC. If tied to VSS or left floating, the write protection is disabled. The WP pin is sampled at the Stop bit for every write command (Figure 3-1) Toggling the WP pin after the Stop bit will have no effect on the execution of the write cycle.
2003 Microchip Technology Inc.
DS21713D-page 7
24AA32A/24LC32A
FIGURE 4-1: BYTE WRITE
S T A CONTROL BYTE R T S 1 0 1 0 AAA 0 210 A C K ADDRESS HIGH BYTE XXX X A C K A C K A C K ADDRESS LOW BYTE S T O P P BUS ACTIVITY MASTER SDA LINE BUS ACTIVITY X = don't care bit
DATA
FIGURE 4-2:
PAGE WRITE
ADDRESS HIGH BYTE XXXX A C K A C K A C K A C K ADDRESS LOW BYTE S T DATA BYTE 31 O P P A C K
S T BUS ACTIVITY A CONTROL BYTE MASTER R T SDA LINE S1 0 1 0AAA 0 210 BUS ACTIVITY X = don't care bit
DATA BYTE 0
DS21713D-page 8
2003 Microchip Technology Inc.
24AA32A/24LC32A
5.0 ACKNOWLEDGE POLLING
FIGURE 5-1:
Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for flow diagram of this operation.
ACKNOWLEDGE POLLING FLOW
Send Write Command
Send Stop Condition to Initiate Write Cycle
Send Start
Send Control Byte with R/W = 0
Did Device Acknowledge (ACK = 0)? YES Next Operation
NO
2003 Microchip Technology Inc.
DS21713D-page 9
24AA32A/24LC32A
6.0 READ OPERATION
6.3 Sequential Read
Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to `1'. There are three basic types of read operations: current address read, random read, and sequential read. Sequential reads are initiated in the same way as a random read, except that once the 24XX32A transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX32A to transmit the next sequentially addressed 8-bit word (Figure 6-3). Following the final byte transmitted to the master, the master will NOT generate an acknowledge but will generate a Stop condition. To provide sequential reads, the 24XX32A contains an internal address pointer which is incremented by `1' upon completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation. The internal address pointer will automatically roll over from address FFF to address 0000 if the master acknowledges the byte received from the array address 0FFF.
6.1
Current Address Read
The 24XX32A contains an address counter that maintains the address of the last word accessed, internally incremented by `1'. Therefore, if the previous read access was to address n (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to `1', the 24XX32A issues an acknowledge and transmits the 8- bit data word. The master will not acknowledge the transfer but does generate a Stop condition and the 24XX32A discontinues transmission (Figure 6-1).
6.2
Random Read
Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be first. This is accomplished by sending the word address to the 24XX32A as part of a write operation (R/W bit set to `0'). Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. The master issues the control byte again, but with the R/W bit set to a `1'. The 24XX32A will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer but does generate a Stop condition which causes the 24XX32A to discontinue transmission (Figure 6-2). After a random Read command, the internal address counter will point to the address location following the one that was just read.
FIGURE 6-1:
CURRENT ADDRESS READ
BUS ACTIVITY MASTER S T A R T S A C K N O A C K CONTROL BYTE S T O P P
DATA (n)
SDA LINE BUS ACTIVITY
DS21713D-page 10
2003 Microchip Technology Inc.
24AA32A/24LC32A
FIGURE 6-2: RANDOM READ
DATA BYTE S T O P P N O A C K S S BUS ACTIVITY T T MASTER A CONTROL ADDRESS ADDRESS A CONTROL R BYTE HIGH BYTE LOW BYTE BYTE R T T SDA LINE S1 0 1 0 AAA0 XXX X S 1 0 1 0 A A A1 210 210 A A A A C C C BUS ACTIVITY C K K K K X = Don't Care Bit
FIGURE 6-3:
SEQUENTIAL READ
DATA n DATA n + 1 DATA n + 2 DATA n + X S T O P P A C K A C K A C K A C K N O A C K
BUS ACTIVITY CONTROL MASTER BYTE SDA LINE BUS ACTIVITY
2003 Microchip Technology Inc.
DS21713D-page 11
24AA32A/24LC32A
7.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 7-1.
TABLE 7-1:
Name A0 A1 A2 VSS SDA SCL WP VCC
PIN FUNCTION TABLE
PDIP 1 2 3 4 5 6 7 8 SOIC 1 2 3 4 5 6 7 8 TSSOP 1 2 3 4 5 6 7 8 MSOP 1 2 3 4 5 6 7 8 ROTATED TSSOP 3 4 5 6 7 8 1 2 Description Chip Address Input Chip Address Input Chip Address Input Ground Serial Address/Data I/O Serial Clock Write-Protect Input +1.8V to 5.5V Power Supply
7.1
A0, A1, A2 Chip Address Inputs
7.3
Serial Clock (SCL)
The A0, A1, A2 inputs are used by the 24XX32A for multiple device operation. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. Up to eight devices may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS.
The SCL input is used to synchronize the data transfer to and from the device.
7.4
Write-Protect (WP)
7.2
Serial Data (SDA)
The WP pin can be connected to either VSS, VCC or left floating. An internal pull-down resistor on this pin will keep the device in the unprotected state if left floating. If tied to VSS, or left floating, normal memory operation is enabled (read/write the entire memory 000-FFF). If tied to VCC, write operations are inhibited. Read operations are not affected.
SDA is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open-drain terminal, therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz) For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions.
DS21713D-page 12
2003 Microchip Technology Inc.
24AA32A/24LC32A
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
Example: 24LC32A I/P13F 0327
8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW
8-Lead SOIC (150 mil) XXXXXXXX T/XXYYWW NNN
Example: 24LC32A I/SN0327 13F
8-Lead SOIC (208 mil)
XXXXXXXX T/XXXXXX YYWWNNN
Example:
24LC32A I/SM 032713F
8-Lead TSSOP XXXX TYWW NNN
Example: 4LA I327 13F
Device STD 24AA32A 24LC32A 4AA 4LA
TSSOP Marking Codes Rot 4AAX 4LAX Pb-free G4AA G4LA Rot G4AAX G4LAX
8-Lead MSOP XXXXXT YWWNNN
Example: 4L32AI 32713F
Device 24AA32A 24LC32A Note:
MSOP Marking Codes STD 4A32 4L32A Pb-free G4AA G4LA
Pb-free part number using "G" suffix is marked on carton
Legend:
XX...X T YY WW NNN
Customer specific information* Temperature grade (I, E) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.
2003 Microchip Technology Inc.
DS21713D-page 13
24AA32A/24LC32A
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
DS21713D-page 14
2003 Microchip Technology Inc.
24AA32A/24LC32A
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
E E1
p
D 2 B n 1
h 45
c A A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
2003 Microchip Technology Inc.
DS21713D-page 15
24AA32A/24LC32A
8-Lead Plastic Small Outline (SM) - Medium, 208 mil (SOIC)
E E1
p D 2 n B 1
c A A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B
MIN
.070 .069 .002 .300 .201 .202 .020 0 .008 .014 0 0
INCHES* NOM 8 .050 .075 .074 .005 .313 .208 .205 .025 4 .009 .017 12 12
MAX
MIN
.080 .078 .010 .325 .212 .210 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.78 1.97 1.75 1.88 0.05 0.13 7.62 7.95 5.11 5.28 5.13 5.21 0.51 0.64 0 4 0.20 0.23 0.36 0.43 0 12 0 12
MAX
2.03 1.98 0.25 8.26 5.38 5.33 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-056
DS21713D-page 16
2003 Microchip Technology Inc.
24AA32A/24LC32A
8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP)
E E1 p
D 2 1 n B
A c
L
A1
A2
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B
MIN
INCHES NOM 8 .026
MAX
MIN
.033 .002 .246 .169 .114 .020 0 .004 .007 0 0
.035 .004 .251 .173 .118 .024 4 .006 .010 5 5
.043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10
MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086
2003 Microchip Technology Inc.
DS21713D-page 17
24AA32A/24LC32A
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E E1
p D 2 B n 1
A c A1 (F)
A2
L
8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF 0 8 Foot Angle c .003 .006 .009 Lead Thickness B .009 .012 .016 Lead Width 5 15 Mold Draft Angle Top 5 15 Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Units Dimension Limits n p
MIN
INCHES NOM
MAX
MIN
MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0 0.08 0.22 5 5 -
MAX
1.10 0.95 0.15
0.80 8 0.23 0.40 15 15
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21713D-page 18
2003 Microchip Technology Inc.
24AA32A/24LC32A
APPENDIX A:
Revision D Corrections to Section 1.0, Electrical Characteristics.
REVISION HISTORY
2003 Microchip Technology Inc.
DS21713D-page 19
24AA32A/24LC32A
NOTES:
DS21713D-page 20
2003 Microchip Technology Inc.
24AA32A/24LC32A
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape(R) or Microsoft(R) Internet Explorer. Files are also available for FTP download from our FTP site.
SYSTEMS INFORMATION AND UPGRADE HOT LINE
The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits. The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003
Connecting to the Microchip Internet Web Site
The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events
2003 Microchip Technology Inc.
DS21713D-page 21
24AA32A/24LC32A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS21713D FAX: (______) _________ - _________
Device: 24AA32A/24LC32A Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21713D-page 22
2003 Microchip Technology Inc.
24AA32A/24LC32A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. Device
X
/XX
X
Examples: a) b) c) d) e) f) 24AA32A-I/P: Industrial Temperature,1.8V, PDIP package 24AA32A-I/SN: Industrial Temperature,1.8V, SOIC package 24AA32A-I/SM: Industrial Temperature.,1.8V, SOIC (208 mil) package 24AA32AX-I/ST: Industrial Temp.,1.8V, Rotated TSSOP package 24AA32A-I/ST: Industrial Temperature.,1.8V, TSSOP package 24AA32A-I/PG: Industrial Temperature.,1.8V, PDIP package. Pb-free
Temperature Package Range
Lead Finish
Device:
24AA32A: 1.8V, 32 Kbit I2C Serial EEPROM 24AA32AT: 1.8V, 32 Kbit I2C Serial EEPROM (Tape and Reel) 24AA32AX 1.8V, 32 Kbit I2C Serial EEPROM in alternate pinout (ST only) 24AA32AXT 1.8V, 32 Kbit I2C Serial EEPROM in alternate pinout (ST only) 24LC32A: 2.5V, 32 Kbit I2C Serial EEPROM 24LC32AT: 2.5V, 32 Kbit I2C Serial EEPROM (Tape and Reel) 24LC32AX 2.5V, 32 Kbit I2C Serial EEPROM in alternate pinout (ST only) 24LC32AXT 2.5V, 32 Kbit I2C Serial EEPROM in alternate pinout (ST only) I E = = -40C to +85C -40C to +125C
g) h) i) j)
24LC32A-I/P: Industrial Temperature, 2.5V, PDIP package 24LC32A-E/SN: Automotive 2.5V SOIC package Temperature,
Temperature Range: Package:
24LC32A-E/SM: Automotive Temperature, 2.5V SOIC (208 mil) package 24LC32AX-E/ST: Automotive Temperature, 2.5V, Rotated TSSOP package 24LC32AT-I/ST: Industrial Temperature, 2.5V, TSSOP package, Tape and Reel 24LC32AT-I/SNG: Industrial Temperature, 2.5V, SOIC package, Tape and Reel, Pb-free
P SN SM ST MS
= = = = =
Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead Plastic SOIC (208 mil body), 8-lead Plastic TSSOP (4.4 mm), 8-lead Plastic Micro Small Outline (MSOP), 8-lead Standard 63% / 37% SnPb Pb-free (Matte Tin - Pure Sn)
k) l)
Lead Finish
Blank = G =
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21713D-page 23
24AA32A/24LC32A
NOTES:
DS21713D-page 24
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21713D-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
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Singapore
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China - Beijing
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Atlanta
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Taiwan
Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803
Boston
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China - Chengdu
Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Taiwan
Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
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China - Fuzhou
Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
Dallas
4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924
EUROPE
Austria
Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
Denmark
Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
China - Shanghai
Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387
France
Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Los Angeles
18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Germany
Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Phoenix
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
China - Shunde
Room 401, Hongjian Building No. 2 Fengxiangnan Road, Ronggui Town Shunde City, Guangdong 528303, China Tel: 86-765-8395507 Fax: 86-765-8395571
Italy
Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
San Jose
2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
China - Qingdao
Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Netherlands
P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340
Toronto
6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
India
Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
United Kingdom
505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820
07/28/03
Japan
Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS21713D-page 26
2003 Microchip Technology Inc.

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